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smsc usb2224 page 1 revision 1.3 (06-13-06) datasheet usb2224 bus powered usb2.0 flash media controller datasheet product features ? complete system solution for interfacing smartmedia tm (sm) or xd picture card tm (xd), memory stick tm (ms), high speed memory stick (hsms), memory stick pro (mspro), ms duo tm , secure digital (sd), mini-secure digital (mini-sd), transflash (sd), multimediacard tm (mmc), reduced size multimedia card (rs- mmc), nand flash, compact flash tm (cf), cf ultra tm i & ii and cf form-factor ata hard drives to usb2.0 bus. ? supports usb bulk only mass storage compliant bootable bios ? support for simultaneous operation of all above devices. (only one at a time of each of the following groups supported: cf or ata drive, sm or xd or nand, sd or mmc) ? on-chip 4-bit high speed memory stick and ms pro hardware circuitry ? on-chip firmware reads and writes high speed memory stick and ms pro ? 1-bit ecc correction performed in hardware for maximum efficiency ? usb bus power certified ? 3.3 volt i/o with 5v input tolerance ? complete usb specificat ion 2.0 compatibility for bus powered operation ? includes usb2.0 transceiver ? a bi-directional control and a bi-directional bulk endpoint are provided. ? 8051 8 bit microprocessor ? provides low speed control functions ? 30 mhz execution speed at 4 cycles per instruction average ? 12k bytes of internal sram for general purpose scratchpad ? 768 bytes of internal sram for general purpose scratchpad or program execution while re-flashing external rom ? double buffered bulk endpoint ? bi-directional 512 byte buffer for bulk endpoint ? 64 byte rx control endpoint buffer ? 64 byte tx control endpoint buffer ? internal or external program memory interface ? 64k byte internal code space or optional 64k byte external code space using flash, sram or eprom memory. ? on board 12mhz crystal driver circuit ? on-chip 1.8v regulator for low power core operation ? internal pll for 480mhz usb2.0 sampling, configurable mcu clock ? supports firmware upgrade via usb bus if ?boot block? flash program memory is used ? 15 gpios for special function use: led indicators, button inputs, power control to memory devices, etc. ? inputs capable of generating interrupts with either edge sensitivity ? attribute bit controlled features: ? activity led polarity/operation/blink rate ? full or partial card compliance checking ? bus or self powered ? lun configuration and assignment ? write protect polarity ? detach on no card inserted for notebook apps ? cover switch operation for xd compliance ? inquiry command operation ? sd write protect operation ? older cf card support ? force usb 1.1 reporting ? compatible with microsoft winxp, winme, win2k sp3, apple os10, softconnex, and linux multi-lun mass storage class drivers ? win2k, win98/98se and apple os8.6 and os9 multi-lun mass storage class drivers available from smsc ? 128 pin tqfp green, lead-free package (1.0mm height, 14mm x14mm footprint)
bus powered usb2.0 flash media controller datasheet revision 1.3 (06-13-06) page 2 smsc usb2224 datasheet ordering information order number: USB2224-NU-XX for 128 pin tqfp package (green, lead-free) 80 arkay drive hauppauge, ny 11788 (631) 435-6000 fax (631) 273-3123 copyright ? 2006 smsc or its subs idiaries. all rights reserved. circuit diagrams and other information rela ting to smsc products are included as a m eans of illustrating typical applications. consequently, complete information sufficient for construction pur poses is not necessarily given. although the informat ion has been checked and is bel ieved to be accurate, no responsibility is assumed for ina ccuracies. smsc reserves the ri ght to make changes to specif ications and product descriptions at any time without notice. contact your local smsc sales office to obtain the late st specifications bef ore placing your product order. the provisi on of this information does not convey to the purchas er of the described semiconducto r devices any licenses under any patent rights or other intellect ual property rights of smsc or others. all sales are expressly conditional on your agr eement to the terms and conditions of the most re cently dated ve rsion of smsc's standard terms of sale agreement dated before the date of y our order (the "terms of sale ag reement"). the product may contain d esign defects or errors known as anomalies which may cause the product's f unctions to deviate from published s pecifications. a nomaly sheets are available upon request. smsc products are not des igned, intended, authorized or wa rranted for use in any life s upport or other application whe re product failure could cause or contri bute to personal injury or severe property damage. an y and all such uses without prior written approval of an officer of smsc and further testing and/or modification will be fully at the risk of the customer. copies of this document or other smsc litera ture, as well as the terms of sale agreement, may be obtained by visiting smsc?s website at http:// www.smsc.com. smsc is a registered tr ademark of standard microsystems corporation (?smsc?). product names and company names are the trademarks of their respective holders. smsc disclaims and excludes any and all warranties, including without limitation any and all implied warranties of merchantability, fitness for a particular purpose, ti tle, and against infringement and the like, and any and all warranties arising from any course of dealing or usag e of trade. in no event shall smsc be liable for any direct, incidental, indirect, special, p unitive, or consequential damages; or for lost data, profits, savings or revenues of any kind; regardless of the form of action, whether based on contract; tort; negligence of smsc or others; strict liability; breach of warranty; or othe rwise; whether or not any remedy of buyer is held to have failed of its essential purpose, and whether or no t smsc has been advised of the possibility of such damages.
bus powered usb2.0 flash media controller datasheet smsc usb2224 page 3 revision 1.3 (06-13-06) datasheet table of contents chapter 1 general d escription ............................................................................................................ .4 chapter 2 acronyms and definitions ................................................................................................... 5 2.1 acronyms ....................................................................................................................... ..................... 5 2.2 defini tions.................................................................................................................... ........................ 5 chapter 3 pin table ...................................................................................................................... ......... 6 3.1 128-pin pa ckage ................................................................................................................ ................. 6 3.2 128 pin list table............................................................................................................. ................... 7 3.2.1 128 pin tqfp................................................................................................................... ........................7 chapter 4 pin configuration.............................................................................................................. ... 8 4.1 128 pin tqfp................................................................................................................... ................... 8 chapter 5 block diagram.................................................................................................................. .... 9 chapter 6 pin descriptions............................................................................................................... ... 10 6.1 pin descr iptions ............................................................................................................... ................. 10 6.2 buffer type de scriptions ....................................................................................................... ............ 15 6.3 gpio usage table ............................................................................................................... ............. 15 chapter 7 dc parame ters .................................................................................................................. .17 7.1 maximum guar anteed ra tings ..................................................................................................... .... 17 7.2 dc electrical c haracteri stics.................................................................................................. ........... 17 chapter 8 package outline................................................................................................................ .. 20 list of figures figure 8.1 - 128 pi n tqfp pack age .............................................................................................. ..............................20 list of tables table 3.1 - pi nout ............................................................................................................. ..............................................6 table 6.1 - pi n descrip tion .................................................................................................... .......................................10 table 6.2 - usb2224 buffer type descriptions ............................................................................................................15 table 6.3 - gpio us age......................................................................................................... ......................................15 table 8.1 - 128 pin tqfp package pa rameters .................................................................................... ......................20
bus powered usb2.0 flash media controller datasheet revision 1.3 (06-13-06) page 4 smsc usb2224 datasheet chapter 1 general description the usb2224 is a usb2.0 bulk only mass stor age class peripheral controller intended for supporting compactflash (cf and cf ultra i/ii) in true ide mode only, smartmedia (sm) and xd cards, memory stick (ms), memory stick duo (msduo) and memory stick pro (mspro), secure digital (sd), and multimediacard (mmc) flash memory devices. it provides a single chip solution for the most popular flash memory cards in the market. the device consists of a usb2.0 phy and sie, buffers, fast 8051 microprocessor with expanded scratchpad, and program sram, and cf, ms, sm and sd controllers. the sd controller supports both sd and mmc devices. provisions for external flash memory up to 64k bytes for program storage is provided. 12k bytes of scratchpad sram and 768 bytes of program sram are also provided. fifteen gpio pins are provided for indicators, ex ternal serial eeprom for oem id and system configuration information, and other special functions. the internal rom program is c apable of implementing any combi nation of single or multi-lun cf/sd/mmc/sm/ms reader functions with individual card power control and activity indication. smsc also provides licenses** for win98 and win2k drivers and set up utilities. note: please check with smsc for precise features and capabilities fo r the current rom code release. *note: in order to develop, make, use, or sell readers and/or other products using or incorporating any of the smsc devices made the subject of this document or to use related smsc so ftware programs, technical information and licenses under patent and other intellectual property rights from or through various per sons or entities, including without limitation media standard companies, forums, and associations, and other patent holders may be required. these media standard companies, forums, and associations include without limitation the following: sony corporation (memory stick, memory stick pro); sd3 llc (secure digital); multimedia card association (multimedi acard); the ssfdc forum (smartmedia); the compact flash association (compact flash); and fuji photo film co., ltd., olympus optical co., ltd., and toshiba corporation (xd-picture card). smsc does not make such licenses or technical informat ion available; does not promise or represent that any such licenses or technical information will actually be obtainable from or through the various persons or entities (including the me dia standard companies, forums, and associations), or with respect to the terms under which they may be made available; and is not responsible for the accuracy or sufficiency of, or otherwise with respect to, any such technical information. smsc's obligations (if any) under the terms of sale agreement, or any other agreement with any customer, or otherwise, with respect to infringement, including without limitation any obligati ons to defend or settle claims, to reimburse for costs, or to pay damages, shall not apply to any of the devices made the subject of this document or any software programs related to any of such devices, or to any combinations involving any of them, with respect to infringement or claimed infringement of any existin g or future patents related to solid state disk or other flash memory technology or applications ("solid state disk patents"). by making any purchase of any of the devices made the subject of this document, the customer represents, warrants, and agrees that it has obtained all necessary licenses under then-existing solid state disk patents for the manufacture, use and sale of solid state disk and other flash memory products and that the customer will timely obtain at no cost or expense to smsc all necessary licenses under solid state disk patents; that the manufac ture and testing by or for smsc of the units of any of the devices made the subject of this document which may be sold to the customer, and any sale by smsc of such units to the customer, are valid exercises of the customer's rights and licenses under such solid state disk patents; that smsc shall have no obligation for royalties or otherwise under any solid state disk patents by reason of any such manufacture, use, or sale of such units; and that smsc shall have no obligation for any costs or expenses related to the customer's obtaining or having obtained rights or licenses under any solid state disk patents. smsc makes no warranties, express, implied, or statutory, in regard to infringement or other violation of intellectual property rights. smsc disclaims and excludes any and all warranties against infringement and the like. no license is granted by smsc expressly, by implication, by estoppel or otherwise, under any patent, trademark, copyright, mask work right, trade secret, or other intellectual property right. **to obtain this software program the appropriate smsc softwar e license agreement must be executed and in effect. forms of these software license agreements may be obtained by contacting smsc.
bus powered usb2.0 flash media controller datasheet smsc usb2224 page 5 revision 1.3 (06-13-06) datasheet chapter 2 acronyms and definitions 2.1 acronyms sm: smartmedia smc: smartmedia controller fm: flash media fmc: flash media controller cf: compact flash cfc: compactflash controller sd: secure digital sdc: secure digital controller mmc: multimediacard ms : memory stick msc : memory stick controller tpc: transport protocol code. ecc: error checking and correcting crc: cyclic redundancy checking xd: xd picture card 2.2 definitions flash media dma unit (fmdu): the control logic in the flash medi a controller block as shown in the block diagram that support the data transfer from cfc, smc, msc and sdc to ep2 buffer directly. sd/mmc: the built-in sd controller (sdc) supports both sd and mmc devices. flash media controller data multiplexer (fmc data mux): the multiplexer to enable the different data path from the different flash media controllers (cfc, smc, msc and sdc).
bus powered usb2.0 flash media controller datasheet revision 1.3 (06-13-06) page 6 smsc usb2224 datasheet chapter 3 pin table 3.1 128-pin package table 3.1 - pinout compactflash interface (28 pins) cf_d0 cf_d1 cf_d2 cf_d3 cf_d4 cf_d5 cf_d6 cf_d7 cf_d8 cf_d9 cf_d10 cf_d11 cf_d12 cf_d13 cf_d14 cf_d15 cf_nior cf_niow cf_irq cf_nreset cf_iordy cf_ncs0 cf_ncs1 cf_sa0 cf_sa1 cf_sa2 cf_ncd1 cf_ncd2 smartmedia / xd interface (17 pins) sm_d0 sm_d1 sm_d2 sm_d3 sm_d4 sm_d5 sm_d6 sm_d7 sm_ale sm_cle sm_nre sm_nwe sm_nwp sm_nb/r sm_nce sm_ncd sm_nwps memory stick interface (7 pins) ms_bs ms_sdio/ms_d0 ms_sclk ms_ins ms_d1 ms_d2 ms_d3 sd interface (7 pins) sd_cmd sd_clk sd_dat0 sd_dat1 sd_dat2 sd_dat3 sd_nwp usb interface (13 pins) usb+ usb- atest rbias vddp vssp (2)vdda (2)vssa vreg xtal1/clkin xtal2 memory/io interface (27 pins) ma0 ma1 ma2 ma3 ma4 ma5 ma6 ma7 ma8 ma9 ma10 ma11 ma12 ma13 ma14 ma15 md0 md1 md2 md3 md4 md5 md6 md7 nmrd nmwr nmce misc (18 pins) nreset gpio1 gpio2 gpio3 gpio4 gpio5 gpio6 /romen gpio7 gpio8 gpio9 gpio10 gpio11 gpio12 gpio13 gpio14 gpio15 ntest0 ntest1 digital, power, ground & nc (11 pins) (3)vddio (4)vssio (2)vddcore (2)vsscore total 128
bus powered usb2.0 flash media controller datasheet smsc usb2224 page 7 revision 1.3 (06-13-06) datasheet 3.2 128 pin list table 3.2.1 128 pin tqfp pin # name ma pin # name ma pin # name ma pin # name ma 1 ma0 8 33 ms_d2 8 65 cf_ncd2 - 97 atest - 2 ma1 8 34 ms_d1 8 66 cf_irq - 98 vddp 3 ma2 8 35 ms_d0 8 67 cf_iordy - 99 xtal2 - 4 vddio 36 ms_sclk 8 68 cf_nior 8 100 xtal1 - 5 ma3 8 37 ms_bs 8 69 cf_niow 8 101 vssp 6 ma4 8 38 sd_nwp - 70 cf_nreset 8 102 vdda(ref) 7 ma5 8 39 vddio 71 cf_ncs0 8 103 rbias - 8 ma6 8 40 sd_dat0 8 72 cf_ncs1 8 104 vssa(ref) 9 ma7 8 41 sd_dat1 8 73 cf_sa0 8 105 vdda 10 ma8 8 42 sd_dat2 8 74 vddio 106 usb+ - 11 ma9 8 43 sd_dat3 8 75 cf_sa1 8 107 usb- - 12 ma10 8 44 sd_cmd 8 76 cf_sa2 8 108 vssa 13 ma11 8 45 sd_clk 8 77 sm_d0 8 109 nreset - 14 ma12 8 46 cf_d0 8 78 sm_d1 8 110 vsscore 15 ma13 8 47 cf_d1 8 79 vssio 111 ntest0 - 16 vddcore 48 cf_d2 8 80 sm_d2 8 112 ntest1 - 17 ma14 8 49 cf_d3 8 81 sm_d3 8 113 gpio1 8 18 ma15 8 50 cf_d4 8 82 sm_d4 8 114 gpio2 8 19 md0 8 51 vssio 83 sm_d5 8 115 gpio3 8 20 md1 8 52 vsscore 84 sm_d6 8 116 gpio4 8 21 md2 8 53 cf_d5 8 85 sm_d7 8 117 gpio5 8 22 md3 8 54 cf_d6 8 86 sm_ale 8 118 gpio6/romen 8 23 vssio 55 cf_d7 8 87 sm_cle 8 119 gpio7 8 24 md4 8 56 cf_d8 8 88 sm_nre 8 120 gpio8 8 25 md5 8 57 cf_d9 8 89 sm_nwe 8 121 gpio9 8 26 md6 8 58 cf_d10 8 90 sm_nwp 8 122 gpio10 8 27 md7 8 59 cf_d11 8 91 vddcore 123 gpio11 8 28 nmrd 8 60 cf_d12 8 92 sm_nce 8 124 vssio 29 nmwr 8 61 cf_d13 8 93 vreg 125 gpio12 8 30 nmce 8 62 cf_d14 8 94 sm_nwps - 126 gpio13 8 31 ms_ins - 63 cf_d15 8 95 sm_nb/r - 127 gpio14 8 32 ms_d3 8 64 cf_ncd1 - 96 sm_ncd - 128 gpio15 8 note 1: rbias is connected to the analog ground plane vssa(ref) via a resistor. note 2: when the internal 1.8v regulat or is enabled, vddcore (91) and v ddp(98), must have a 10uf +/- 20%, (equivalent series resistance (esr ) <0.1ohm) bypass capacitor to vssa. note 3: vdda(ref) and vssa(ref) are same as the vdda and vssa respectively.
bus powered usb2.0 flash media controller datasheet revision 1.3 (06-13-06) page 8 smsc usb2224 datasheet chapter 4 pin configuration 4.1 128 pin tqfp gpio15 gpio14 gpio13 gpio12 vssio gpio11 gpio10 gpio9 gpio8 gpio7 gpio6/romen gpio5 gpio4 gpio3 gpio2 gpio1 ntest1 ntest0 vsscore nreset vssa usb- usb+ vdda vssa(ref) rbias vdda(ref) vssp xtal1 xtal2 vddp atest ms_d2 ms_d1 ms_d0 ms_sclk ms_bs sd_nwp vddio sd_dat0 sd_dat1 sd_dat2 sd_dat3 sd_cmd sd_clk cf_d0 cf_d1 cf_d2 cf_d3 cf_d4 vssio vsscore cf_d5 cf_d6 cf_d7 cf_d8 cf_d9 cf_d10 cf_d11 cf_d12 cf_d13 cf_d14 cf_d15 cf_ncd1 usb2224 32 64 96 1 ma0 ma1 ma2 vddio ma3 ma4 ma5 ma6 ma7 ma8 ma9 ma10 ma11 ma12 ma13 vddcore ma14 ma15 md0 md1 md2 md3 vssio md4 md5 md6 md7 nmrd nmwr nmce ms_ins ms_d3 sm_ncd sm_nb/r sm_nwps vreg sm_nce vddcore sm_nwp sm_nwe sm_nre sm_cle sm_ale sm_d7 sm_d6 sm_d5 sm_d4 sm_d3 sm_d2 vssio sm_d1 sm_d0 cf_sa2 cf_sa1 vddio cf_sa0 cf_ncs1 cf_ncs0 cf_nreset cf_niow cf_nior cf_iordy cf_irq cf_ncd2
bus powered usb2.0 flash media controller datasheet smsc usb2224 page 9 revision 1.3 (06-13-06) datasheet chapter 5 block diagram d a t a b u s s usb 2.0 phy ( transciever ) fast 8051 cpu core gpio 15 pins 7 pins configuration and control clock generation xtal sie ( serial interface engine ) program memory/ io bus interrupt controller latch phase 0, 2 sie latch phase 3 8051 latch phase 1 fmc 60mhz 32 bit osc address xdata & sfr address and data busses 64 bytes ep0tx 64 bytes ep0rx 64 bytes ep1tx 64 bytes ep1rx auto address generators address mux data @ 32 bit 15mhz sie control regs address address address address ep0rx_bc ramrd_a/b ep0tx_bc ramwr_a/b 32 bit 15mhz data buss clockout 12 mhz 512 bytes ep2 tx/rx buffer a address register 1.25kb sram 12k byte scratchpad sram clocked byphase 0, 2 clock clocked by phase 3 clock 512 bytes ep2 tx/rx buffer b memory cards scratchpad sram (768 byte) fmc data mux ecc control/ status sd controller sd/hs sd/ mmc flash media controllers (fmc) control/ status ms controller ms/hs ms/ms pro control/ status sm controller sm/ssfdc control/ status cf controller cf control/ status crc mem/io bus 29pins data data data data crc ep1tx_bc ep1rx_bc address address flash media dma unit 64k rom romen
bus powered usb2.0 flash media controller datasheet revision 1.3 (06-13-06) page 10 smsc usb2224 datasheet chapter 6 pin descriptions this section provides a detailed description of each signal. the signal s are arranged in functional groups according to their associated interface. the ?n? symbol in the signal name indicates that the ac tive, or asserted state occurs when the signal is at a low voltage level. when ?n? is not present before the signal name, the signal is a sserted when at the high voltage level. the terms assertion and negation are used exclusively. this is done to avoid confusion when working with a mixture of ?active low? and ?activ e high? signal. the term assert, or assertion indicates that a signal is active, independent of whether that level is represented by a high or low voltage. the term negate, or negation indicates that a signal is inactive. 6.1 pin descriptions table 6.1 - pin description name symbol buffer type description compactflash (in true ide mode) interface cf chip select 1 cf_ncs1 o8 this pin is the active low chip select 1 signal for the cf ata device cf chip select 0 cf_ncs0 o8 this pin is the active low chip select 0 signal for the task file registers of cf ata device in the true ide mode. cf register address 2 cf_sa2 o8 this pin is the register select address bit 2 for the cf device. cf register address 1 cf_sa1 o8 this pin is the register select address bit 1 for the cf device. cf register address 0 cf_sa0 o8 this pin is the register select address bit 0 for the cf device. cf interrupt cf_irq ipd this is the acti ve high interrupt request signal from the cf device. cf data 15-8 cf_d[15:8] i/o8 the bi-directional data signals cf_d15-cf_d8 in true ide mode data transfer. the bi-directional data signal has an internal weak pull-down resistor. cf data7-0 cf_d[7:0] i/o8 the bi-directional dat a signals cf_d7-cf_d0 in the true ide mode data transfer. in the true ide mode, all of task file register operation occur on the cf_d[7:0], while the data transfer is on cf_d[15:0]. the bi-directional data signal has an internal weak pull- down resistor. io ready cf_iordy ipu this pin is active high input signal from cf card. cf card detection2 cf_ncd2 ipu this card detection pi n is connected to the ground on the cf device, when the cf device is inserted. cf card detection1 cf_ncd1 ipu this card detection pin is connected to ground on the cf device, when the cf device is inserted.
bus powered usb2.0 flash media controller datasheet smsc usb2224 page 11 revision 1.3 (06-13-06) datasheet name symbol buffer type description cf hardware reset cf_nreset o8 this pin is an active low hardware reset signal to cf device. cf io read cf_nior o8 this pin is an active low read strobe signal for cf device, when the cfc is enabled. cf io write strobe cf_niow o8 this pin is an active low write strobe signal for cf device, when the cfc is enabled. smartmedia interface sm write protect sm_nwp o8 this pin is an active low write protect signal for the sm device, when the smc is enabled. sm address strobe sm_ale o8 this pin is an active high address latch enable signal for the sm device, when the smc is enabled. sm command strobe sm_cle o8 this pin is an active high command latch enable signal for the sm device, when the smc is enabled. sm data7-0 sm_d[7:0] i/o8 these pins are the bi-directional data signal sm_d7- sm_d0, when the smc is enabled. sm read enable sm_nre o8 this pin is an active low read strobe signal for sm device, when smc is enabled. sm write enable sm_nwe o8 this pin is an active low write strobe signal for sm device, when smc is enabled. sm write protect switch sm_nwps ipu a write-protect seal is detected, when this pin is low. sm busy or data ready sm_nb/r i this pin is connected to the bsy/rdy pin of the sm device. an external pull-up resistor is required on this signal. the pull-up resistor should be attached to the power of sm/nand flash device. sm chip enable sm_nce o8 this pin is the active low chip enable signal to the sm device. sm card detection sm_ncd ipu this is the card detection signal from sm device to indicate if the device is inserted. memory stick interface ms bus state ms_bs o8 this pin is connec ted to the bs pin of the ms device. it is used to control the bus states 0, 1, 2 and 3 (bs0, bs1, bs2 and bs3) of the ms device. ms system data in/out ms_sdio /ms_d0 i/o8 this pin is a bi-directional data signal for the ms device. most significant bit (msb) of each byte is transmitted first by either msc or ms device. the bi-directional data signal has an internal weak pull- down resistor. ms system data in/out ms_d1 io8pd this pin is a bi-directional data signal for the ms device. the bi-directional data signal has an internal weak pull- down resistor that is internally controlled. ms system data in/out ms_d[3:2] i/o8 this pin is a bi-directional data signal for the ms device. the bi-directional data signal has an internal weak pull- down resistor. ms card insertion ms_ins ipu this pin is the card det ection signal from the ms device to indicate, if the device is inserted.
bus powered usb2.0 flash media controller datasheet revision 1.3 (06-13-06) page 12 smsc usb2224 datasheet name symbol buffer type description ms system clk ms_sclk o8 this pin is an output clock signal to the ms device. sd interface sd data3-0 sd_dat[3:0] i/o8 these are bi-directional data signals. sd clock sd_clk o8 this is an output clock signal to sd/mmc device. sd command sd_cmd i/o8 this is a bi-directional signal that connects to the cmd signal of sd/mmc device. sd write protected sd_nwp ipd this pin is write protect switch input signal with an internal weak pull-down. usb interface usb bus data usb- usb+ io-u these pins connect to the usb bus data signals. usb transceiver bias rbias i a 12.0k 1% resistor is attached from ground to this pin to set the transceiver?s internal bias currents. analog test atest ioa this signal is us ed for testing the analog section of the chip and should be connected to vdda for normal operation. 1.8v analog power vddp 1.8v analog power this pin must have a 10uf +/- 20%, (equivalent series resistance (esr) <0.1ohm) bypass capacitor to vssa. this capacitor should be plac ed as close to the pin as possible. analog ground reference vssp analog ground reference for 1.8v analog power. 3.3v analog power vdda 3.3v analog power analog ground reference vssa analog ground reference for 3.3v analog power. 1.8v voltage regulator for usb phy vreg this pin is connected to 3.3v. crystal input/external clock input xtal1/ clkin iclkx 12mhz crystal or external clock input. this pin can be connected to one terminal of the crystal or can be connected to an external 12mhz clock when a crystal is not used. crystal output xtal2 oclkx 12mhz crystal this is the other terminal of the crystal, or left open when an external clock source is used to drive xtal1/clkin. it may not be used to drive any external circuitry other than the crystal circuit. memory/io interface memory data bus md[7:0] io8 when using external program memory, these signals are used to transfer data between the internal cpu and the external program memory. when using internal program rom, internal weak pull up resistors are activated to prev ent these pins from floating.
bus powered usb2.0 flash media controller datasheet smsc usb2224 page 13 revision 1.3 (06-13-06) datasheet name symbol buffer type description memory address bus ma[15:0] o8 these signals address memory locations within the external memory. memory read strobe nmwr o8 program memory write; active low memory read strobe nmrd o8 program memory read; active low memory chip enable nmce o8 program memory chip enable; active low. this signal is asserted, when the device is not is suspend mode. note: this signal is held in a logic ?high? state (inactive) during nreset assertion. misc gpio6, romen and rxd gpio6 /romen i/o8pu this pin has an internal weak pullup resistor that can be enabled or disabled by the state of nreset. the pullup is enabled when nreset is active. the pullup is disabled, when the nreset is inactive (some clock cycles later, after the rising edge of nreset). the state of this pin is la tched internally on the rising edge of nreset to determine if internal or external program memory is used. the state latched is stored in romen bit of gpio_in1 register. after the rising edge of nreset, this pin may be used as gpio6 or rxd. when pulled low via an external weak pulldown resistor, an external program memory should be connected to the memory data bus. the usb2224 uses this external bus for program execution. when this pin is left unconnected or pulled high by a weak pullup resistor, the u sb2224 uses the internal rom for program execution. this pin?s function while operating from internal rom is shown in table 6.3 - gpio usage. general purpose i/o gpio1 i/o8 this pin may be used either as input, edge sensitive interrupt input, or output. this pin?s function while operating from internal rom is shown in table 6.3 - gpio usage. general purpose i/o gpio2 i/o8 this pin may be used either as input, edge sensitive interrupt input, or output. this pin?s function while operating from internal rom is shown in table 6.3 - gpio usage. general purpose i/o gpio3 i/o8 this pin may be used either as input, edge sensitive interrupt input, or output. this pin?s function while operating from internal rom is shown in table 6.3 - gpio usage.
bus powered usb2.0 flash media controller datasheet revision 1.3 (06-13-06) page 14 smsc usb2224 datasheet name symbol buffer type description general purpose i/o gpio4 i/o8 this pin may be used either as input, edge sensitive interrupt input, or output. this pin?s function while operating from internal rom is shown in table 6.3 - gpio usage. general purpose i/o gpio5 i/o8 this pin may be used either as input, edge sensitive interrupt input, or output. this pin?s function while operating from internal rom is shown in table 6.3 - gpio usage. general purpose i/o gpio7 i/o8 this pin may be used either as input, edge sensitive interrupt input, or output. this pin?s function while operating from internal rom is shown in table 6.3 - gpio usage. general purpose i/o gpio[15:8] i/o8 these pins may be used either as input, or output. these pins? functions while operating from internal rom are shown in table 6.3 - gpio usage. reset input nreset is this active low signal is used by the system to reset the chip. the active low pulse should be at least 1 s wide. test input ntest[0:1] i these signals are used for testing the chip. user should normally tie them high externally. digital power, grounds, and no connects 1.8v digital core power vddcore +1.8v core power all vddcore pins must be connected t ogether on the circuit board. pin 91 must have a 10uf +/- 20%, (equivalent series resistance (esr) <0.1ohm) bypass capacitor to vssa, and this capacitor should be plac ed as close to the pin as possible. 3.3v digital i/o power vddio +3.3v i/o power vddcore reference ground vsscore vddcore ground reference vddio reference ground vssio vddio ground reference note 1: hot-insertion capable card connectors are required for a ll of flash medias. it is required for sd connector to have write protect switch. this allows the chip to detect mmc card. note 2: nmce is normally asserted except when the system is in standby mode.
bus powered usb2.0 flash media controller datasheet smsc usb2224 page 15 revision 1.3 (06-13-06) datasheet 6.2 buffer type descriptions table 6.2 - usb2224 buffer type descriptions buffer description i input ipu input with controlled internal weak pull-up resistor. ipd input with controlled inte rnal weak pull-down resistor. is input with schmitt trigger i/o8 input/output with 8ma drive i/od8 input/open drain output ? 8ma sink o8 output with 8ma drive i/o8pu input/output with 8ma drive controlled weak pull-up resistor i/o8pd input/output with 8ma drive controlled weak pull-down resistor iclkx xtal clock input oclkx xtal clock output i/o-u analog input/output defi ned in usb specification o-u analog output i-u analog input oia special analog input/output 6.3 gpio usage table table 6.3 - gpio usage name active level symbol description and note gpio1 h/l act/door media activity led / xd door sw input gpio2 h ee_cs serial ee prom chip select gpio3 h v_bus usb v bus detect gpio4 h/l ee_din/ee_dout/xdid se rial ee prom input/output and xd id pin input gpio5 l sd_cd sd card detect sw input. in production rom versions, this pin must always be pulled high except to indicate sd card insertion. if no sd interface is used, this pin must still be pulled high for proper operation. gpio6 h a16 ( external rom only ) /romen int/ext rom select. external program memory a16 address line connect for dfu. gpio7 h ee_clk serial ee prom clock output gpio8 l ms power control memory stick card power control gpio9 l cf power control com pactflash card power control gpio10 l sm power control smartmedia card power control gpio11 l sd power control sd/mmc card power control
bus powered usb2.0 flash media controller datasheet revision 1.3 (06-13-06) page 16 smsc usb2224 datasheet name active level symbol description and note gpio12 h ms/mspro activity memory stick(/pro) activity indicator gpio13 h cf activity compac tflash activity indicator gpio14 h sm/xdactivity smartmedia/xd activity indicator gpio15 h sd/mmc activity sd /mmc activity indicator
bus powered usb2.0 flash media controller datasheet smsc usb2224 page 17 revision 1.3 (06-13-06) datasheet chapter 7 dc parameters 7.1 maximum guaranteed ratings operating temper ature r ange .................................................................................................. 0 o c to +70 o c storage temperat ure range .................................................................................................. -55 o to +150 o c lead temperature range (solder ing, 10 sec onds) ............................................................................. +325 o c positive voltage on any pin, with respec t to ground ............................................................................ ... 5.5v negative voltage on any pin, with respec t to ground ............................................................................ -0.3v maximum v dd, v ddp .............................................................................................................................. + 2.5v maximum v ddio, v dda ............................................................................................................................ +4. 0v * stresses above the specified paramet ers could cause permanent damage to the device. this is a stress rating only and functional operation of the device at any other conditi on above those indicated in the operation sections of this s pecification is not implied. notes: ? when powering this device from laborator y or system power supplies, it is important that the absolute maximum ratings not be exceeded or device failure can result. some power supplies exhibit voltage spikes on their outputs when the ac power is switched on or off. in addition, voltage transients on the ac power line may appear on the dc output. when this possibility exists, it is suggested that a clamp circuit be used. ? the name ?vdd? is the same as vddcore 7.2 dc electrical characteristics (t a = 0c - 70c, v ddio, v dda = +3.3 v 10%, v dd, v ddp = +1.8 v 10%,) parameter symbol min typ max units comments i type input buffer low input level high input level v ili v ihi 2.0 0.8 v v ttl levels is type input buffer low input level high input level hysteresis v ili v ihi v hysi 2.0 500 0.8 v v mv ttl levels
bus powered usb2.0 flash media controller datasheet revision 1.3 (06-13-06) page 18 smsc usb2224 datasheet parameter symbol min typ max units comments iclk input buffer low input level high input level v ilck v ihck 2.2 0.4 v v input leakage (all i and is buffers) low input leakage high input leakage i il i ih -10 -10 +10 +10 ua ua v in = 0 v in = v ddio o8 type buffer low output level high output level output leakage v ol v oh i ol 2.4 -10 0.4 +10 v v ua i ol = 8 ma @ v ddio = 3.3v i oh = -4ma @ v ddio = 3.3v v in = 0 to v ddio (note 7.1) i/o8 type buffer low output level h igh o utput l evel output leakage v ol v oh i ol 2.4 -10 0.4 +10 v v a i ol = 8 ma @ v ddio = 3.3v i oh = -4 ma @ v ddio = 3.3v v in = 0 to v ddio (note 7.1) i/o12 type buffer low output level high output level output leakage v ol v oh i ol 2.4 -10 0.4 +10 v v a i ol = 12 ma @ v ddio = 3.3v i oh = -6ma @ v ddio = 3.3v v in = 0 to v ddio (note 7.1)
bus powered usb2.0 flash media controller datasheet smsc usb2224 page 19 revision 1.3 (06-13-06) datasheet parameter symbol min typ max units comments i/o24 type buffer low output level high output level output leakage v ol v oh i ol 2.4 -10 0.4 +10 v v a i ol = 24 ma @ v ddio = 3.3v i oh = -12 ma @ v ddio = 3.3v v in = 0 to v ddio (note 7.1) io-u supply current unconfigured i ccinit 45 10 60 20 ma ma @ v dd, v ddp = 1.8v @ v ddio, v dda = 3.3v supply current active (full speed) i cc 35 15 60 30 ma ma @ v dd, v ddp = 1.8v @ v ddio, v dda = 3.3v supply current active (high speed) i cc 45 15 70 30 ma ma @ v dd, v ddp = 1.8v @ v ddio, v dda = 3.3v supply current standby i csby 160 215 180 240 a a @ v dd, v ddp = 1.8v @ v ddio, v dda = 3.3v note 7.1 output leakage is measured with the current pins in high impedance. capacitance t a = 25c; fc = 1mhz; v dd, v ddp = 1.8v limits parameter symbol min typ max unit test condition clock input capacitance c in 20 pf input capacitance c in 10 pf output capacitance c out 20 pf all pins except usb pins (and pins under test tied to ac ground)
bus powered usb2.0 flash media controller datasheet revision 1.3 (06-13-06) page 20 smsc usb2224 datasheet chapter 8 package outline figure 8.1 - 128 pin tqfp package table 8.1 - 128 pin tqfp package parameters min nominal max remarks a ~ ~ 1.20 overall package height a1 0.05 ~ 0.15 standoff a2 0.95 ~ 1.05 bod y thickness d 15.80 ~ 16.20 x span d1 13.80 ~ 14.20 x bod y size e 15.80 ~ 16.20 y span e1 13.80 ~ 14.20 y bod y size h 0.09 ~ 0.20 lead frame thickness l 0.45 0.60 0.75 lead foot len g th l1 ~ 1.00 ~ lead len g th e 0.40 basic lead pitch 0 o ~ 7 o lead foot angle w 0.13 0.18 0.23 lead width r1 0.08 ~ ~ lead shoulder radius r2 0.08 ~ 0.20 lead foot radius ccc ~ ~ 0.08 coplanarit y notes: 1) controlling unit: millimeter. 2) tolerance on the true position of the leads is 0.035 mm maximum. 3) package body dimensions d1 and e1 do not include the mold protrusion. maximum mold protrusion is 0.25 mm. 4) dimension for foot length l measured at the gauge plane 0. 25 mm above the seating plane. 5) details of pin 1 identifier are optional but must be located within the zone indicated.

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